Packaging Technology of SiC Power Electronics
نویسندگان
چکیده
منابع مشابه
Parasitics in Power Electronics Packaging
In this paper we investigate the influence of 1st-level packaging components on the electromagnetic behaviour of power electronic modules. The main goal is to identify the critical layout paths and packaging components and to understand the mechanisms that affect the module performance. Several power electronics packaging technologies are compared on the basis of their electrical and electromag...
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ژورنال
عنوان ژورنال: Journal of The Japan Institute of Electronics Packaging
سال: 2014
ISSN: 1343-9677,1884-121X
DOI: 10.5104/jiep.17.112